Shishi Technology has received tens of millions of yuan in Pre-A+round financing, deepening the technological barrier of HAI unified computing platform

Recently, Shi Technology (Pinghu) Co., Ltd., a domestic enterprise that integrates high-performance computing (HPC) and AI infraintelligence computing, announced the completion of tens of millions of yuan in Pre-A+round financing. This round of financing is led by Beijing Cornerstone Venture Capital and followed by Jiaxing Pinghu Financial Investment.

According to Tianyancha Information, Shi Technology was established in 2021 and jointly formed by the core research team of the National Supercomputing Wuxi Center. It is one of the earliest teams in China to industrialize the technology of parallel optimization of supercomputing and intelligent computing. Building a leading HAI unified computing platform with “HPC+AI” as the core technology, providing computing power scheduling, parallel optimization, and model expert services. The team currently has over 100 R&D personnel, accounting for more than 70%, with core members from 985 universities and research institutions such as Tsinghua University and Peking University.

Shi Technology is committed to building a low-level computing infrastructure that covers supercomputing and intelligent computing, gradually forming a full stack technology capability from computing scheduling platform, Infra optimization framework to upper level model application services. On this basis, the company further developed and launched the HAI unified computing platform. The HAI Infra framework layer of this platform has high compatibility and professionalism, which can achieve adaptation, unified scheduling, and collaborative operation to support multiple domestic computing chips, provide integrated training and inference support, and integrate deeply optimized AI operator libraries and industry-specific operator libraries, significantly improving the execution efficiency of complex computing tasks.

At present, the HAI unified computing platform has been deployed in over 20 application fields, supporting more than 200 key research projects and 2 million computing tasks.

This round of financing will mainly be used in three directions: deepening the technical barriers of HAI unified computing platform, accelerating the iteration and innovation of industry expert model services, and promoting the scale expansion of the market and the recruitment of top talents.